LPKF and Harting agree on cooperation / Launch of LDS method in micro-packaging
Garbsen (ots) - LPKF Laser & Electronics AG and the Harting technology group have signed a cooperation agreement. This partnership enables Harting to produce and further develop 3D-MIDs for micro-packaging in particular - using the LPKF LDS method. Micro-packaging is used for very compact housings for chips and similar components and is therefore a very small type ...
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